Integrated circuit packaging: Difference between revisions

Cost is a factor in selection of integrated circuit packaging. Typically, an inexpensive plastic package can dissipate heat up to 2W, which is sufficient for many simple applications, though a similar ceramic package can dissipate up to 50W in the same scenario.<ref name=":02"/> As the chips inside the package get smaller and faster, they also tend to get hotter. As the subsequent need for more effective heat dissipation increases, the cost of packaging rises along with it. Generally, the smaller and more complex the package needs to be, the more expensive it is to manufacture.<ref name=":1" /> Wire bonding can be used instead of techniques such as flip-chip to reduce costs.<ref>{{cite web | url=https://sst.semiconductor-digest.com/2005/07/wire-bond-vs-flip-chip-packaging/ | title=Wire Bond Vs. Flip Chip Packaging &#124; Semiconductor Digest | date=10 December 2016 }}</ref>

[[Ball grid array]] (BGA) packages have existed since the 1970s, but evolved into flip-chip ball grid array (FCBGA) packages in the 1990s. FCBGA packages allow for much higher pin count than any existing package types. In an FCBGA package, the die is mounted upside-down (flipped) and connects to the [[package ball]]s via a substrate that is similar to a printed-circuit board rather than by wires. FCBGA packages allow an array of input-output signals (called Area-I/O) to be distributed over the entire die rather than being confined to the die periphery.<ref>{{Cite web|url=http://flipchips.com/tutorial01.html |title=Flipchips: Tutorial #1 |last=Riley |first=George |date=2009-01-30 |access-date=2016-04-07 |url-status=unfit |archive-url=https://web.archive.org/web/20090130092400/http://flipchips.com/tutorial01.html |archive-date=January 30, 2009 }}</ref> Ceramic subtrates for BGA were replaced with organic substrates to reduce costs and use existing PCB manufacturing techniques to produce more packages at a time by using larger PCB panels during manufacturing.<ref>{{cite book | url=https://books.google.com/books?id=tyJZ3eZQy7UC&dq=hdi+pcb+ajinomoto&pg=PA243 | isbn=978-0-387-78219-5 | title=Materials for Advanced Packaging | date=17 December 2008 | publisher=Springer }}</ref>

* [[List of integratedelectronic circuitcomponent packaging types|Transistor, diode, small pin count IC packages]]

AfterFor traditional ICs, after [[wafer dicing]], the die is picked from the diced wafer using a vaccumvacuum tip or suction cup<ref>Die Attachment, Fluid Dispensing catalog from SPT small precision tools</ref><ref>{{cite web | url=https://www.eetimes.com/die-bonding-techniques-and-methods/ | title=Die bonding techniques and methods | date=9 July 2012 }}</ref> and undergoes ''die attachment'' which is the step during which a die is mounted and fixed to the [[Chip carrier|package]] or support structure (header).<ref name="Turner762">L. W. Turner (ed), ''Electronics Engineers Reference Book'', Newnes-Butterworth, 1976, {{ISBN|0-408-00168-2}}, pages 11-34 through 11-37</ref> ForIn high-powered applications, the die is usually [[eutectic]] bonded onto the package, using e.g. gold-tin or gold-silicon [[solder]] (for good [[heat conduction]]). For low-cost, low-powered applications, the die is often glued directly onto a substrate (such as a [[printed wiring board]]) using an [[epoxy]] [[adhesive]].

* [[List of integratedelectronic circuitcomponent packaging types]]