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- research-articleMarch 2023
On Legalization of Die Bonding Bumps and Pads for 3D ICs
ISPD '23: Proceedings of the 2023 International Symposium on Physical DesignPages 62–70https://doi.org/10.1145/3569052.3578925State-of-the-art 3D IC Place-and-Route flows were designed with older technology nodes and aggressive bonding pitch assumptions. As a result, these flows fail to honor the width and spacing rules for the 3D vias with realistic pitch values. We propose a ...
- research-articleMarch 2023
AutoDMP: Automated DREAMPlace-based Macro Placement
- Anthony Agnesina,
- Puranjay Rajvanshi,
- Tian Yang,
- Geraldo Pradipta,
- Austin Jiao,
- Ben Keller,
- Brucek Khailany,
- Haoxing Ren
ISPD '23: Proceedings of the 2023 International Symposium on Physical DesignPages 149–157https://doi.org/10.1145/3569052.3578923Macro placement is a critical very large-scale integration (VLSI) physical design problem that significantly impacts the design power-performance-area (PPA) metrics. This paper proposes AutoDMP, a methodology that leverages DREAMPlace, a GPU-accelerated ...
- research-articleMarch 2023
DREAM-GAN: Advancing DREAMPlace towards Commercial-Quality using Generative Adversarial Learning
ISPD '23: Proceedings of the 2023 International Symposium on Physical DesignPages 141–148https://doi.org/10.1145/3569052.3572993DREAMPlace is a renowned open-source placer that provides GPU-acceleratable infrastructure for placements of Very-Large-Scale-Integration (VLSI) circuits. However, due to its limited focus on wirelength and density, existing placement solutions of ...