Showing 1–1 of 1 results for author: Liu, G Y

Chip-level CMP Modeling and Smart Dummy for HDP and Conformal CVD Films

Authors: George Yong Liu, Ray F. Zhang, Kelvin Hsu, Lawrence Camilletti

Abstract: Chip-level CMP modeling is investigated to obtain the post-CMP film profile thickness across a die from its design layout file and a few film deposition and CMP parameters. The work covers both HDP and conformal CVD film. The experimental CMP results agree well with the modeled results. Different algorithms for filling of dummy structure are compared. A smart algorithm for dummy filling is prese… ▽ More Chip-level CMP modeling is investigated to obtain the post-CMP film profile thickness across a die from its design layout file and a few film deposition and CMP parameters. The work covers both HDP and conformal CVD film. The experimental CMP results agree well with the modeled results. Different algorithms for filling of dummy structure are compared. A smart algorithm for dummy filling is presented, which achieves maximal pattern-density uniformity and CMP planarity. △ Less

Submitted 9 November, 2000; originally announced November 2000.

Comments: 10 pages, 7 figures; for used software, see http://www.cmptechnology.com/

ACM Class: B.7.2

Journal ref: Proceedings of CMPMIC 99, pp120-127